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12.12.2006 New Thermal Models for Vishay Optocoupler Products
Vishay Intertechnology announced that it is now providing detailed thermal characteristics for newly released optocouplers and solid-state relays (SSRs) that have total power dissipation of 200 mW and higher.
 The thermal data supplied by Vishay will allow designers to more accurately simulate heat distribution and thermal impedance for optocoupler and SSR devices. Common thermal characteristics of junction-to-ambient or junction-to-case thermal impedance are readily available, as well as all the other components in the thermal network. Designers can use these values to calculate temperatures for a given operating condition. The thermal behavior for a given application will be dependent on the type of PCB, the specifics of the layout, and the thickness of the copper traces.
The FLOTHERM analysis software tool used to model Vishay’s optocoupler and solid-state relay devices uses computational fluid dynamics techniques to predict the in situ airflow and temperature environment of components and PCBs in industrial equipment, computers, telecommunication systems, and other end products. This enables the designer to identify the source of any over-heating, and to devise and test appropriate design modifications quickly and easily.
Vishay is one of the world’s largest manufacturers of optocoupler products. The company’s optoelectronic portfolio includes optocouplers, solid-state relays, infrared data communication transceivers (IRDCs), IR sensors, IR receivers, LEDs, and custom optoelectronic devices.
The first Vishay optocoupler products for which the detailed thermal characteristics are available are the 60-V, 10-Ω VO1400AEFT2 SSR, the 0.5-A VO3150 IGBT driver, the 1.5k-V/µs VO3063 and VO3062 and 5-kV/µs VO4154, VO4156, VO4157 and VO4158 zero-crossing phototriacs; and the 5-kV/µs VO4254, VO4256, VO4257 , and VO4258non-zero-crossing phototriacs.
For more information about Vishay see: www.vishay.com
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12.08.2010
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Card-Loks and Wedge-Loks: clamping devices Particularly harsh environmental conditions often demand special fixing components for electronics mounting systems. Now Schroff has added products of this type from its sister companies Birtcher and Calmark, both also members of the Pentair Technical Products Group, to its standard product range. If required, these products can also be customised, or custom solutions developed with them.
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12.08.2010
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CompactPCI Serial/CompactPCI PlusIO systems - Soft Migration to up to 32 Gb/s Schroff has developed systems and backplanes for this specification. An example is an 8-slot hybrid backplane with three CompactPCI peripheral slots, one CompactPCI PlusIO system slot and four CompactPCI Serial peripheral slots. This backplane has three rear I/O slots in the CompactPCI bus area. This represents the maximum configuration for hybrid systems and can therefore be used for the most diverse of applications. Backplanes with fewer slots, e.g. 5, are being developed.
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12.08.2010
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CompactPCI system 3+1 U Schroff is a leading developer and manufacturer of packaging systems for the electronics, automation, IT and communications industries. The standard production program includes cabinets, enclosures, block frames, power supply units, backplanes up to module constructive components for microprocessor systems. Due to a wide variety of intergation components Schroff can offer complete systems Plug + Play for 19“ equipment.
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25.06.2010
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INTERNATIONAL FORUM "ELEKTRO - 2010" On June 7-10, 2010 the 19th International Exhibition Elektro’2010 took place on the territory of Expocentre Fairgrounds. It is the hugest industrial show, successfully vindicating the reputation of the most significant event in the field of electrical technology on the territory of the Russian Federation and the CIS.
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19.05.2010
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WAGO 750 Series I/O systems Wago has got the License of Federal Service on Ecological, Technological and Nuclear Supervision for use of WAGO 750 Series I/O systems. License term: 11.05.2010 – 11.05.2015.
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06.05.2010
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Hannover Messe 2010 In spite of major travel limitations resulting from the international flight embargo ITC has successfully attended as exhibitor at the Hannover Messe 2010. A special highlight was the ITC-booth with a new design and new colours.
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09.03.2010
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ITC –Electronics together with ELEKTROSHIT company invite everyone to visit main exhibition "ELEKTRO-2010" The 19th International exhibition "ELEKTRO-2010" is going to be held in Moscow, June 7-10, at the territory of Main Exhibition complex "EXPOCENTRE".
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26.02.2010
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100 °C, RoHS 6/6, UL certified SMD-Miniature DC/DC Converters from RECOM The new R1S/R1D & R2S/R2D series 1 Watt and 2 Watt SMD Miniature DC/DC Converters are available with single or dual outputs from mid January 2010.
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26.02.2010
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Re³inforced DC/DC Converters offer up to 10kVDC Isolation RECOM has designed the first DC/DC-Converter in a DIP24 case that breaks the 10kV barrier! These new converters, the REC3.5 and REC6 families, offer 10kVDC (5kVAC) isolation using a revolutionary new transformer concept with "Re3inforced" Technology.
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03.02.2010
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ITC- ELECTRONICS is going to take part in annual exhibition in HANNOVER 2010. Annual exhibition "HANNOVER MESSE" is taking place in Hannover (Germany) in April,19-23, 2010.
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16.10.2009
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New leaflet: "Everything a system needs" The standardized system solutions, modified standard components and individual new developments, Schroff as being an expert of electronic equipment, offers everything a system needs. New 16-page leaflet provides the description of products, services and references for development and manufacture of conformal electronic systems.
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10.09.2009
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Modular enclosures Hoffman PROLINE® for industrial application Schroff company presents a new delivery program of Hoffman Proline enclosures for Russian customers. These cabinets are commonly used in electrotechnical and electronic industry.
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06.08.2009
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Main catalogue: the new one is out! Running to over 1100 pages, the main catalogue of Schroff provides detailed technical information on the company"s complete range of products, including cabinets, cases, sub-racks, plug-in units, embedded systems, backplanes, power supplies and climate control means.
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11.07.2009
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ITC GmbH gehört zu den 100 innovativsten Unternehmen im deutschen Mittelstand. Das hat die aktuelle Untersuchung im Rahmen des bundesweiten, branchenübergreifenden Unternehmensvergleichs "Top 100" ergeben. Unser Unternehmen überzeugte bei der 17.Runde der renommierten Wirtschaftsinitiative mit einem maßgeschneiderten Innovationsmanagement.
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10.07.2009
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ITC-Electronics is among 100 best Medium-sized Businesses of Germany! This fact is confirmed by the competition «Top-100», that takes place on the territory of Germany once a year.
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10.07.2009
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Schroff presented a new delivery program of Proline cabinets In March 2009 Schroff company presented a new delivery program of Proline electrotechnical cabinets.
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23.06.2009
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Eine der zehn besten Sekretärinnen Deutschlands 2009 Beruf einer Sekretärin ist abwechselungsreich und umfasst einen grossen Aufgabengebiet. Doch das wahre Können besteht dies mit einem Lächeln, taktvoll und mit Niveau zu verbinden.
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22.06.2009
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International Forum “Elektro-2009” Within 8-11 June in Moscow at the Central Exhibition Complex “EXPOCENTRE” it was carried out the most large-scale exhibition “ELEKTRO-2009” in the field of electrical engineering of Russia and the CIS countrie
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06.05.2009
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HANNOVER MESSE 2009, 20-24 April, Hannover, Germany For the 60th time the exhibition "Hannover Messe" opened its gates to the international Industry from 20th till 24th of April 2009. With 6 150 exhibitors from more than 61 countries and 210 000 international visitors the world largest and most important industrial fair communicated optimism and innovative strength in times of the world economic crisis.
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31.03.2009
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19" frame-type plug-in units PRO: increased functionality at a lower price For its off-the-shelf 19" frame-type plug-in unit range Schroff has now developed a new, cost-optimised family of plug-in units that offer improved airflow (up to 65 %), greater robustness, better EMC shielding and considerably faster assembly, resulting in reduced costs.
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